E Series FusionServer CH121 v3

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FusionServer CH121 V3 Compute Node
Dense computing capabilities plus large memory capacity for enterprise service applications — virtualization, cloud computing, and HPC clusters

This compute node combines dense computing with an ultra-large memory. It is optimized for enterprise service applications such as virtualization, cloud computing, and High-Performance Computing (HPC).

It forms part of the CH100 and CH200 families of compute nodes, which are fully compatible with Huawei’s E9000 Blade Server.

This efficient compute node features dynamic energy-saving and power-capping technologies that manage and control power consumption with remarkably reduced low-load operating power.

Carrier-class design, manufacturing, and components ensure high quality.

Huawei server with Intel® Xeon® processor.

Intel, the Intel logo, Xeon, and Xeon Inside are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries.

Huawei E900 Featured Benefits

  • Intel® Xeon® processor E5-2600 v3 family contain up to two 18-core, 2.3 GHz processors to power each compute node.

  • 24 DDR4 DIMMs, providing a maximum memory capacity of 1.5 TB.

  • Reduces O&M costs with remote deployment and fault location technologies such as SOL, KVM over IP, virtual DVD-ROM drive, WebUI, and IPMI 2.0-compliance.

  • Nodes include efficient, secure power consumption analysis and control capabilities, including power-off mode, and Intel® NM 3.0 compliance.

Product Specification
Form Factor Half-width 2-socket compute node
Number of Processors

1 or 2

Processor Models Intel® Xeon® E5-2600 v3 series
Number of DIMMs 24 DDR4 DIMMs, providing a maximum memory capacity of 1.5 TB
Number of Hard Disks 2 x 2.5-inch SSDs, SAS HDDs, or SATA HDDs, supporting 2 x PCIe SSD HDDs
Built-in Storage • 2 x Mini-SSDs (SATA DOM)
• 2 x Micro-SD cards (RAID1)
• 1 x USB 3.0
RAID Support RAID 0 and 1
PCIe Expansion • 2 PCIe x16 Mezz modules
• 1 standard PCIe x16 full-height, half-length card
Operating Systems Support • Microsoft Windows Server 2008/2012
• Red Hat Enterprise Linux
• SUSE Linux Enterprise Server
• Oracle Linux
• CentOS
• Huawei Fusionsphere
• Citrix XenServer
• VMware
Operating Temperature 5°C to 40°C
Dimensions • Height: 60.46 mm (2.38 in.)
• Width: 210 mm (8.27 in.)
• Depth: 537.2 mm (21.15 in)