Combines ultra-high-density computing with a large memory. It is optimized for enterprise service applications such as virtualization, cloud computing, and HPC. It’s powered by Intel® Xeon® processors.

This efficient compute node features dynamic energy-saving and power-capping technologies that manage and control power consumption with remarkably reduced low-load operating power. Carrier-class design, manufacturing, and components ensure high quality.

Intel, the Intel logo, Xeon, and Xeon Inside are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries.